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                  4寸藍寶石襯底

                  2014-09-01




                  藍寶石晶片



                  Item


                  4"

                  Unit

                   Dimension


                  Diameter:


                  100 ± 0.15

                  mm


                  Thickness:


                  650 ± 20

                  um


                  Primary Flat:


                  301.0

                  mm

                  Orientation


                  Surface-cut:


                  C plane : Tilt 0.2°±0.1° in M axis /

                  ~


                  Primary Flat:


                  A plane : 0° ± 0.15°

                  ~

                  Flatness


                  Bow:


                   0 ~ (-10)

                  um


                  Warp:


                  20

                  um


                  Total Thickness Variation (TTV):


                  10

                  um


                  LTV


                  2.5

                  um


                  Front side Roughness


                  0.2

                  nm


                  Back side Roughness


                  0.8-1.2

                  um


                  Cleanliness


                  No particles and fingerprints

                  ~


                  4.Material Quality


                  High-purity mono-crystal Al2O3

                  ~

                   

                  5.Package


                  Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.


                  ~

                   

                  6.Trace Ability


                  Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.


                  ~

                   

                  7.Laser Mark


                  Front or Back side


                  ~

                   

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